COPPER PLATING
- Copper is an excellent undercoat for subsequent deposits,
since it is a good metal to cover substrate defects such
as holes and splinters. Buffing cooper, which is very
easy to do, even improves upon its ability to be an excellent
substrate. Copper, and buffer copper, can provide an easy-to-plate
highly level and bright substrate.
- Copper is among the less expensive metals and is in
relatively stable supply. More leveling can be obtained
for the cost of the metal electroplated than for any other
metal.
- Copper has a high plating efficiency and many copper
plating processes offer good coverage and throwing power.
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